IK-650 Pro
Universal Modular Soldering Reworking Center
Developed for multiple tasks related with removing & installation components which demand thermo-profiling. Modular design allows to build the system up and down upon process requirements. Widely used by people who visit their customers to help them with rework & repair.
The system guarantees 100% repeatability of a soldering process without any tuning after each run, what let to incorporate it into a assembly line.
The best Price/Quality ratio for this type of machinery
Controlled by "TermoPro Center"IK-650 Pro controlled by "ThermoPro Center" software which automatically adjusts temperature on a board supporting a desired thermal profiles. Optional Air Cooler FC-500 can automatically generate cooling zone in thermal profile when required. |
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Features and Applications:
- Wide range of PCB sizes can be processed
- Uniform heating field eliminates deformation of PCB and effect to alignment components
- Precise control of the operation temperature with 100% guaranteed results
- High repeatable thermo profiles
- Can be used for traditional or ROHS solder technology
- Upgradeable modular design
- Soldering SMD-components on PCB by tracing preliminary developed, tested and tuned thermo-profile;
- Thermo-profiles development and tuning. Feed-back links between multiple sensors and sofware afford operator to optimize a profile in a way ideally meet a PCB specific;
- Pre-heating of PCB’s during soldering and de-soldering of SMD-components by different technique;
- Control of Themperature parameters during pre-heating and soldering;
- Pre-heating of silicon wafers at the solar battery production process;
- Pre-heating of ceramic components before process them what reduce microcracking;
- Chems thermo-polimerization;
- BGA components re-balling;
- Preliminary heating of metal parts (joints) before its soldering and/or welding;
- PCB utilization by mass components de-soldering;
- Other Lab needs where the temperature control in small zone is required.
Technological capabilities
- Big and "Hard" BGA with a thick solidaluminum casing
- BGA - CBGA, CCGA, PBGA, μBGA, FCBGA,LFBGA, CGA,CSP, QFN, QFP, MLF, PGA
- Plastic and metal connectors
Technical specification
| Upper Heater of IK-650 Pro | |
| Upper heating area | 60 õ 60 mm |
| IR sourse / wavelength | Ceramic Elstein (Germany) / 2-10µm |
| Ò max | +650°C |
| P max | 250 Watt |
| PCB Pre-heater of IK-650 Pro | |
| Temperature rang | 50 - 350 °C |
| Temperature accuracy | ± 2°C |
| Max possible temperature difference on working surface, excluding corners | ± 4°C (at a temperature of 200°C) |
| P max | 2 x 1400 Watt |
| Number of independent heating zones | 2 |
| Working surface size L x W | 340 õ 240 mm |
| Other parameters | |
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Recommended distance from PCB to Upper Emitter diaphragm For flat diaphragm For 3D concentrator |
15-25ìì |
| Recommended Processed PCB dimensions / max | 350 x 250 mm / 400 x 300 mm |
| Temperature control / Interface | With thermoprofile at PC program / USB |
| Thermoprofile accuracy (typical value) | ± 3°C |
| Voltage / Power | ~220-230V – 50Hz / 3000Wt |
| Weight | 20 kg |
- Products
- IK 650 Pro